View SAF-XC164SM-16F20F_4184148.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

data sheet, v1.2, march 2007 microcontrollers xc164sm 16-bit single-chip microcontroller with c166sv2 core
edition 2007-03 published by infineon technologies ag 81726 munich, germany ? 2007 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical valu es stated herein and/or any information regarding the application of the device, infineon technologies her eby disclaims any and all warranties and liabilities of any kind, including wi thout limitation, warranties of non-infrin gement of intellectual property rights of any third party. information for further information on technology, delivery terms an d conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the near est infineon technologies office. infineon technologies components may be used in life-supp ort devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that device or system. life support devices or systems are intended to be implanted in the hu man body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
data sheet, v1.2, march 2007 microcontrollers xc164sm 16-bit single-chip microcontroller with c166sv2 core
xc164sm derivatives data sheet v1.2, 2007-03 xc164sm revision history: v1.2, 2007-03 previous version(s): v1.1, 2006-08 v1.0, 2005-11 page subjects (major chan ges since last revision) 6 design steps of the derivatives differentiated. 50 power consumption of the derivatives differentiated. 51 figure 10 adapted. 52 figure 12 adapted. 62 packages of the deriva tives differentiated. 63 thermal resistance s of the derivati ves differentiated. all ?preliminary? removed we listen to your comments any information within this do cument that you feel is wrong, unclear or missing at all? your feedback will help us to continuously improve the quality of this document. please send your proposal (including a reference to th is document) to: mcdocu.comments@infineon.com
xc164sm derivatives table of contents data sheet 3 v1.2, 2007-03 1 summary of features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 general device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 pin configuration and definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.1 memory subsystem and organiza tion . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 central processing unit (cpu) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3 interrupt system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.4 on-chip debug support (ocds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.5 capture/compare unit (capcom2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.6 the capture/compare unit capc om6 . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.7 general purpose timer (gpt12e) unit . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.8 real time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.9 a/d converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.10 asynchronous/synchronous serial interfaces (asc0/asc1) . . . . . . . . . . 36 3.11 high speed synchronous seri al channels (ssc0/ssc1) . . . . . . . . . . . . 37 3.12 watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3.13 clock generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.14 parallel ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.15 power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.16 instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 4 electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 4.1 general parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 4.2 dc parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.3 analog/digital converter parame ters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 4.4 ac parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 4.4.1 definition of internal timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 4.4.2 on-chip flash operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 4.4.3 external clock drive xtal1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 5 package and reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 5.1 packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 5.2 flash memory parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 table of contents
xc164sm 16-bit single-chip microc ontroller with c166sv2 core xc166 family data sheet 4 v1.2, 2007-03 1 summary of features for a quick overview or reference, the xc164sm?s properties ar e listed here in a condensed way. ? high performance 16-bit cpu with 5-stage pipeline ? 25 ns instruction cycle time at 40 mhz cpu clock (singl e-cycle execution) ? 1-cycle multiplication (16 16 bit), background division (32 / 16 bit) in 21 cycles ? 1-cycle multiply-and-accumu late (mac) instructions ? enhanced boolean bit manipulation facilities ? zero-cycle jump execution ? additional instructions to su pport hll and operating systems ? register-based design with mult iple variable register banks ? fast context switching support with two additional loca l register banks ? 16 mbytes total linear addr ess space for code and data ? 1024 bytes on-chip special function re gister area (c166 family compatible) ? 16-priority-level interrupt system with up to 63 sources, sample-rate down to 50 ns ? 8-channel interrupt -driven single-cycle data transfer facilities via peripheral event controller (pec), 24-bit pointers cover total address space ? clock generation via on-chip pll (factors 1:0.15 ? 1:10), or via prescaler (factors 1:1 ? 60:1) ? on-chip memory modules ? 2 kbytes on-chip dual-port ram (dpram) ? 0/2/4 kbytes 1) on-chip data sram (dsram) ? 2 kbytes on-chip progr am/data sram (psram) ? 32/64/128 1) kbytes on-chip program memory (flash memory) ? on-chip peripheral modules ? 14-channel a/d converter wi th programmable resolution (10-bit or 8-bit) and conversion time (down to 2.55 s or 2.15 s) ? 16-channel general purpose ca pture/compare unit (capcom2) ? capture/compare unit fo r flexible pwm signal generation (capcom6) ? multi-functional general pur pose timer unit with 5 timers ? two synchronous/asynchronous serial channels (usarts) ? two high-speed-synchr onous serial channels ? on-chip real time clock, dr iven by the main oscillator ? idle, sleep, and power down mode s with flexible power management ? programmable watchdog time r and oscillator watchdog 1) depends on the respective derivative. see table 1 ?xc164sm derivative synopsis? on page 6 .
xc164sm derivatives summary of features data sheet 5 v1.2, 2007-03 ? up to 47 general purpose i/o lines, partly with selectable input thresholds and hysteresis ? on-chip bootstrap loader ? on-chip debug support via jtag interface ? 64-pin green lqfp package for the -16f derivatives, 0.5 mm (1 9.7 mil) pitch (rohs compliant) ? 64-pin tqfp package for the -4f/8f de rivatives, 0.5 mm (19.7 mil) pitch (rohs compliant) ordering information the ordering code for infineon microcontrol lers provides an exact reference to the required product. this or dering code identifies: ? the derivative itself, i.e. it s function set, the temperature range, and the supply voltage ? the package and the type of delivery. for the available ordering code s for the xc164sm please refe r to your responsible sales representative or your local distributor. this document describes several derivatives of the xc164sm group. table 1 enumerates these derivatives and summarizes the difference s. as this document refers to all of these derivatives, some descriptions may not a pply to a specific product. for simplicity all versions are referred to by the term xc164sm throughout this document.
xc164sm derivatives summary of features data sheet 6 v1.2, 2007-03 table 1 xc164sm derivative synopsis derivative 1) 1) this data sheet is valid for: devices starting with and including design step ba for the -16f derivatives, and for devices starting with and including design step aa for -4f/8f derivatives. temp. range program memory on-chip ram interfaces saf-xc164sm-16f40f SAF-XC164SM-16F20F -40 to 85 c 128 kbytes flash 2 kbytes dpram, 4 kbytes dsram, 2 kbytes psram asc0, asc1, ssc0, ssc1 saf-xc164sm-8f40f saf-xc164sm-8f20f -40 to 85 c 64 kbytes flash 2 kbytes dpram, 2 kbytes dsram, 2 kbytes psram asc0, asc1, ssc0, ssc1 saf-xc164sm-4f40f saf-xc164sm-4f20f -40 to 85 c 32 kbytes flash 2 kbytes dpram, 2 kbytes psram asc0, asc1, ssc0, ssc1
xc164sm derivatives general device information data sheet 7 v1.2, 2007-03 2 general device information the xc164sm derivatives are high-performance members of the infineon xc166 family of full featured single-chi p cmos microcontrollers. these devices extend the functionality and performance of the c166 fa mily in terms of instructions (mac unit), peripherals, and spee d. they combine high cpu perf ormance (up to 40 million instructions per second) with high peripheral functionality and enhanced io- capabilities. they also provide clock gene ration via pll and various on-chip memory modules such as program flash, program ram, and data ram. figure 1 logic symbol m ca05554_xc164sm xc164sm xtal1 xtal2 nmi rstin port 5 14 bit port1 14 bit port 3 15 bit port 9 6 bit v agnd v aref v ddi/p v ss trst
xc164sm derivatives general device information data sheet 8 v1.2, 2007-03 2.1 pin configuration and definition the pins of the xc164sm ar e described in detail in table 2 , including all their alternate functions. figure 2 summarizes all pins in a condens ed way, showing their location on the 4 sides of the package. e* marks pins to be used as altern ate external interrupt inputs. figure 2 pin configuration (top view) mc_xc164sm_pinout . vs d p1l.0/cc60 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 v ar ef p5.0/an0 v ss p5 . 6 /a n6 p5 . 12 / an1 2 / t6i n p5 . 13 / an1 3 / t5i n p5.14/an14/t4eud p5.15/an15/t2eud p3 . 1 /t 6out/ rxd1 / tck/ e* p3.2/capin/tdi p3.3/t3out/tdo p3.4/t3eud/tms p3.8/mrst0 p3.9/mtsr0 p3.10/txd0/e* p3.11/rxd0/e* p3.13/sclk0/e* v ddp v ss p3 . 1 5 / cl kout/ fout p9 . 0 / cc1 6 i o/ e* p1 h. 0 / cc6 pos0 / ex0 i n/ cc2 3 i o p1 h. 1 / cc6 pos1 / ex1 i n/ m rst1 p1 h. 2 / cc6 pos2 / ex2 i n/ m trs1 p1 h. 3 / ex3 i n/ t7 i n/ scl k1 p3 . 7 / t2 i n/ brki n p1l.1/cout60 p1l.2/cc61 p1h.4/cc24io/ex4in p 1 h . 5 / c c 2 5 i o / e x 5 i n p1l.7/ctrap/cc22io v ddp v ddi v ss trst rstin nmi xta l 1 xta l 2 v ddp p5.1/an1 p5.2/an2 p5.3/an3 p5.4/an4 p5.5/an5 p5.10/an10/t6eud p5.11/an11/t5eud p5 . 7 /a n7 v ag nd v ss v ddi v ddp p3.5/t4in/txd1/brkout p3.6/t3in p9.1/cc17io p9 . 2 / cc1 8 i o/ e* p9.3/cc19io p9.4/cc20io p9.5/cc21io p1l.3/cout61 p1l.4/cc62 p1l.5/cout62 p1l.6/cout63 xc164sm
xc164sm derivatives general device information data sheet 9 v1.2, 2007-03 table 2 pin definitions and functions sym- bol pin num. input outp. function rstin 63 i reset input with schmitt-tri gger characteristics. a low-level at this pin while the oscillator is running resets the xc164sm. a spike filter suppre sses input pulses < 10 ns. input pulses > 100 ns safely pass the filter . the minimum duration for a safe recognition should be 100 ns + 2 cpu clock cycles. note: the reset duration must be sufficient to let the hardware configurat ion signals settle. external circuitry must guarantee low-level at the rstin pin at least until both power supply voltages have reached the operating range. nmi 64 i non-maskable interrupt input. a hi gh to low transition at this pin causes the cpu to vector to the nmi trap routine. when the pwrdn (power do wn) instruction is executed, the nmi pin must be low in order to force the xc164sm into power down mode. if nmi is high, when pwrdn is executed, the part will continue to run in normal mode. if not used, pin nmi should be pulled high externally. port 9 p9.0 p9.1 p9.2 p9.3 p9.4 p9.5 43-48 43 44 45 46 47 48 io i/o i i/o i/o i i/o i/o i/o port 9 is a 6-bit bidirectiona l i/o port. each pin can be programmed for input (output driver in high-impedance state) or output (configurable as push/pul l or open drain driver). the input threshold of port 9 is se lectable (standard or special). the following port 9 pins also serve for alternate functions: cc16io: (capcom2) cc16 capt ure inp./compare outp., ex5in: (fast external interrupt 5) input (alternate pin a) cc17io: (capcom2) cc17 capt ure inp./compare outp., cc18io: (capcom2) cc18 capt ure inp./compare outp., ex4in: (fast external interrupt 4) input (alternate pin a) cc19io: (capcom2) cc19 capt ure inp./compare outp., cc20io: (capcom2) cc20 capt ure inp./compare outp. cc21io: (capcom2) cc21 capt ure inp./compare outp. note: at the end of an external reset p9.4 and p9.5 also may input startup conf iguration values
xc164sm derivatives general device information data sheet 10 v1.2, 2007-03 port 5 p5.0 p5.1 p5.2 p5.3 p5.4 p5.5 p5.10 p5.11 p5.6 p5.7 p5.12 p5.13 p5.14 p5.15 9-18, 21-24 9 10 11 12 13 14 15 16 17 18 21 22 23 24 i i i i i i i i i i i i i i i port 5 is a 14-bit input-only port. the pins of port 5 also serve as analog input channels for the a/d converter, or they serve as timer inputs: an0 an1 an2 an3 an4 an5 an10 (t6eud): gpt2 timer t6 ext. up/down ctrl. inp. an11 (t5eud): gpt2 timer t5 ext. up/down ctrl. inp. an6 an7 an12 (t6in): gpt2 time r t6 count/gate input an13 (t5in): gpt2 time r t5 count/gate input an14 (t4eud): gpt1 timer t4 ext. up/down ctrl. inp. an15 (t2eud): gpt1 timer t2 ext. up/down ctrl. inp. trst 62 i test-system reset input. fo r normal system operation, pin trst should be held low. a high level at this pin at the rising edge of rstin enables the hardware configuration and activates the xc164sm?s debu g system. in this case, pin trst must be driven low once to reset the debug system. table 2 pin definitions and functions (cont?d) sym- bol pin num. input outp. function
xc164sm derivatives general device information data sheet 11 v1.2, 2007-03 port 3 p3.1 p3.2 p3.3 p3.4 p3.5 p3.6 p3.7 p3.8 p3.9 p3.10 p3.11 p3.13 p3.15 28-39, 42 28 29 30 31 32 33 34 35 36 37 38 39 42 io o i/o i i i i o o i i i o o i i i i/o i/o o i i/o i i/o i o o port 3 is a 13-bit bidirectio nal i/o port. each pin can be programmed for input (output driver in high-impedance state) or output (configurable as push/pul l or open drain driver). the input threshold of port 3 is selectable (standard or special).the following port 3 pi ns also serve for alternate functions: t6out: [gpt2] timer t6 toggle latch output, rxd1: [asc1] data input (a sync.) or inp./outp. (sync.), ex1in: [fast external interrupt 1] input (alternate pin a), tck: [debug system] jtag clock input capin: [gpt2] register caprel capture input, tdi: [debug syst em] jtag data in t3out: [gpt1] timer t3 toggle latch output, tdo: [debug system] jtag data out t3eud: [gpt1] timer t3 exte rnal up/down control input, tms: [debug system] jtag test mode selection t4in: [gpt1] timer t4 coun t/gate/reload/c apture inp. txd1: [asc0] clock/data output (async./sync.), brkout : [debug system] break out t3in: [gpt1] timer t3 count/gate input t2in: [gpt1] timer t2 coun t/gate/reload/c apture inp. brkin : [debug system] break in mrst0: [ssc0] master-recei ve/slave-transmit in/out. mtsr0: [ssc0] master-trans mit/slave-receive out/in. txd0: [asc0] clock/data output (async./sync.), ex2in: [fast external interrupt 2] input (alternate pin b) rxd0: [asc0] data input (a sync.) or inp./outp. (sync.), ex2in: [fast external interrupt 2] input (alternate pin a) sclk0: [ssc0] master clock output / slave clock input., ex3in: [fast external interrupt 3] input (alternate pin a) clkout: system clock output (= cpu clock), fout: programmable frequency output table 2 pin definitions and functions (cont?d) sym- bol pin num. input outp. function
xc164sm derivatives general device information data sheet 12 v1.2, 2007-03 port1 p1l.0 p1l.1 p1l.2 p1l.3 p1l.4 p1l.5 p1l.6 p1l.7 p1h.0 p1h.1 p1h.2 p1h.3 p1h.4 p1h.5 1-6, 49-56 49 50 51 52 53 54 55 56 1 2 3 3 5 6 io i/o o i/o o i/o o o i i/o i i i/o i i i/o i i i/o i i/o i i/o i i/o i port1 consists of one 8-bit a nd one 6-bit bidirectional i/o port p1l and p1h. each pin can be programmed for input (output driver in high-imp edance state) or output. the following port1 pins al so serve for alt. functions: cc60: [capcom6] input / output of channel 0 cout60: [capcom6] output of channel 0 cc61: [capcom6] input / output of channel 1 cout61: [capcom6] output of channel 1 cc62: [capcom6] input / output of channel 2 cout62: [capcom6] output of channel 2 cout63: output of 10-bit compare channel ctrap : [capcom6] trap input ctrap is an inpu t pin with an internal pull-up resistor. a lo w level on this pin switches the capcom6 compare outputs to the logic level defined by software (if enabled). cc22io: [capcom2] cc22 capt ure inp./compare outp. cc6pos0 : [capcom6] position 0 input, ex0in: [fast external interrupt 0] input (default pin), cc23io: [capcom2] cc23 capt ure inp./compare outp. cc6pos1 : [capcom6] position 1 input, ex1in: [fast external interrupt 1] input (default pin), mrst1: [ssc1] master-recei ve/slave-transmit in/out. cc6pos2 : [capcom6] position 2 input, ex2in: [fast external interrupt 2] input (default pin), mtsr1: [ssc1] master-trans mit/slave-receive out/inp. t7in: [capcom2] time r t7 count input, sclk1: [ssc1] master clock output / slave clock input, ex3in: [fast external interrupt 3] input (default pin), cc24io: [capcom2] cc24 capt ure inp./compare outp., ex4in: [fast external interru pt 4] input (default pin) cc25io: [capcom2] cc25 capt ure inp./compare outp., ex5in: [fast external interru pt 5] input (default pin) note: at the end of an external reset p1h.4 and p1h.5 also may input startup configuration values table 2 pin definitions and functions (cont?d) sym- bol pin num. input outp. function
xc164sm derivatives general device information data sheet 13 v1.2, 2007-03 xtal2 xtal1 61 60 o i xtal2: output of the o scillator amplifier circuit xtal1: input to the oscillator amplifie r and input to the internal clock generator to clock the device from an external source, drive xtal1, while leaving xtal2 unconnec ted. minimum and maximum high/low and rise/fall times spec ified in the ac characteristics must be observed. note: input pin xtal1 belongs to the core vo ltage domain. therefore, input voltages must be within the range defined for v ddi . v aref 19 ? reference voltage for the a/d converter v agnd 20 ? reference ground for the a/d converter v ddi 26, 58 ? digital core supply voltage (on-chip modules): +2.5 v during normal op eration and idle mode. please refer to the operating condition parameters v ddp 8, 27, 40, 57 ? digital pad supply voltag e (pin output drivers): +5 v during normal oper ation and idle mode. please refer to the operating condition parameters v ss 7, 25, 41, 59 ? digital ground connect decoupling capa citors to adjacent v dd / v ss pin pairs as close as possible to the pins. all v ss pins must be connected to the ground-l ine or ground- plane. table 2 pin definitions and functions (cont?d) sym- bol pin num. input outp. function
xc164sm derivatives functional description data sheet 14 v1.2, 2007-03 3 functional description the architecture of the xc164sm combin es advantages of risc, cisc, and dsp processors with an advanced peripheral subsystem in a very well-balanced way. in addition, the on-chip memory blocks allow the design of compact systems-on-silicon with maximum performance (computi ng, control, communication). the on-chip memory blocks (program code-memory and sram, dual-port ram, data sram) and the set of generic peripherals ar e connected to the cp u via separate buses. another bus, the lxbus, connects additional on -chip resources (see figure 3 ). this bus structure enhances the overall system performanc e by enabling the concurrent operation of several su bsystems of the xc164sm. the following block diagram gi ves an overview of the diff erent on-chip components and of the advanced, high b andwidth internal bus st ructure of the xc164sm. figure 3 block diagram i nt errupt bus xtal osc / pll clock generation rtc wdt gpt t2 t3 t4 t5 t6 ssc0 br gen (spi) asc1 br gen (u sar t) adc 8/ 10-bit 14 c hannels cc2 t7 t8 progmem 14 port 5 psram 2 kbytes dpram 2 kbytes dsram 0/2/4 kbytes c166sv2-core pmu dm u cpu asc0 br gen (u sar t) ssc1 br gen (spi) por t1 port 3 port 9 14 13 6 interrupt & pec p eripheral data b us ocds debug support cc6 t12 t13 32/64/128 kbytes mc_xc164sm_block1.vsd flash
xc164sm derivatives functional description data sheet 15 v1.2, 2007-03 3.1 memory subsystem and organization the memory space of the xc164 sm is configured in a von neumann architecture, which means that all internal and external resources, such as code memory, data memory, registers and i/o ports, are organized with in the same linear address space. this common memory space includes 16 mbytes and is arranged as 256 segments of 64 kbytes each, where each segment consists of four data pages of 16 kbytes each. the entire memory space can be accessed byte wise or wo rd wise. portions of the on-chip dpram and the register spaces (e/s fr) have additionally been made directly bit addressable. the internal data memory areas and the sp ecial function register areas (sfr and esfr) are mapped into segm ent 0, the system segment. the program management unit (pmu) handles all code fetches and, therefore, controls accesses to the program memories, such as flash memory and psram. the data management unit (d mu) handles all data transf ers and, therefore, controls accesses to the dsram and the on-chip peripherals. both units (pmu and dmu) are connected via the high-spe ed system bus to exchange data. this is required if operands are read fr om program memory, code or data is written to the psram. the system bu s allows concurrent two-wa y communication for maximum transfer performance. 32/64/128 kbytes of on-chip flash memory 1) store code or cons tant data. the on-chip flash memory is organized as four 8-kbyte sectors and up to three 32-kbyte sectors. each sector can be sepa rately write protected 2) , erased and prog rammed (in blocks of 128 bytes). the complete flash area c an be read-protected. a password sequence temporarily unlocks protected areas. the flas h module combines very fast 64-bit one- cycle read accesses with protected and effici ent writing algorithms for programming and erasing. thus, program execution out of the internal flash results in maximum performance. dynamic error co rrection provides extremely hi gh read data security for all read accesses. programming typically takes 2 m s per 128-byte block (5 ms max.), erasing a sector typically takes 200 ms (500 ms max.). 2 kbytes of on-chip program sram (psram) are provided to store user code or data. the psram is accessed via the pmu and is therefore optimized for code fetches. 0/2/4 kbytes 1) of on-chip data sram (dsram) are provided as a storage for general user data. the dsram is accessed via the dmu and is therefor e optimized for data accesses. dsram is no t available in the xc164sm-4f derivatives. 2 kbytes of on-chip dual-port ram (dpram) are provided as a storage for user defined variables, for the syst em stack, general purpose regi ster banks. a register bank 1) depends on the respective derivative. see table 1 ?xc164sm derivative synopsis? on page 6 . 2) each two 8-kbyte sectors are comb ined for write-protection purposes.
xc164sm derivatives functional description data sheet 16 v1.2, 2007-03 can consist of up to 16 word wi de (r0 to r15) and/or byte wide (rl0, rh0, ?, rl7, rh7) so-called general purp ose registers (gprs). the upper 256 bytes of the dpram are direct ly bit addressable. when used by a gpr, any location in the dpram is bit addressable. 1024 bytes (2 512 bytes) of the address space are rese rved for the special function register areas (sfr space an d esfr space). sfrs are wo rd wide registers which are used for controlling and monitori ng functions of the differen t on-chip units. unused sfr addresses are reserved for fu ture members of the xc166 fam ily. therefore, they should either not be accessed, or written with zeros, to en sure upward compatibility. table 3 xc164sm memory map address area start loc. end loc. area size 1) 1) the areas marked with ? xc164sm derivatives functional description data sheet 17 v1.2, 2007-03 3.2 central processing unit (cpu) the main core of the cpu co nsists of a 5-stage executio n pipeline with a 2-stage instruction-fetch pipeline, a 16- bit arithmetic and logic unit (alu), a 32-bit/40-bit multiply and accumulate unit (mac), a re gister-file providing three re gister banks, and dedicated sfrs. the alu features a multiply and divi de unit, a bit-mask ge nerator, and a barrel shifter. figure 4 cpu block diagram based on these hardware provisions, most of the xc164sm?s instructions can be executed in just one mach ine cycle which requires 25 ns at 40 mhz cpu clock. for dpram cpu ipip rf r0 r1 gprs r14 r15 r0 r1 gprs r14 r15 ifu injection/ exception handler adu mac mca04917_x.vsd cpucon1 cpucon2 csp ip return stack fifo branch unit prefetch unit vecseg tfr +/- idx0 idx1 qx0 qx1 qr0 qr1 dpp0 dpp1 dpp2 dpp3 spseg sp stkov stkun +/- mrw mcw msw mal +/- mah m ultiply unit alu division unit m ultiply u nit bit-mask-gen. barrel-shifter +/- mdc psw mdh zeros mdl ones r0 r1 gprs r14 r15 cp wb buffer 2-stage prefetch pipeline 5-stage pipeline r0 r1 gprs r14 r15 pmu dmu dsram ebc peripherals psram flash/rom
xc164sm derivatives functional description data sheet 18 v1.2, 2007-03 example, shift and rotate instructions are always processed du ring one machine cycle independent of th e number of bits to be shifted. also multiplication and most mac instructions execute in one single cycle. all multiple -cycle instructions have been optimized so that they can be executed very fast as we ll: for example, a 32-/16-bit division is started within 4 cycles, while the remaining 15 cycles are executed in the background. another pipeline optimization, the branch target prediction, allows eliminating the execution time of branch instructions if the prediction was correct. the cpu has a register context consisting of up to three register banks with 16 word wide gprs each at its disposal. one of thes e register banks is physically allocated within the on-chip dpram area. a context pointer (cp) register determi nes the base address of the active register bank to be accessed by the cpu at any time. the number of register banks is only restricted by the available intern al ram space. for easy parameter passing, a register bank may overlap others. a system stack of up to 32 kwords is prov ided as a storage fo r temporary data. the system stack can be allo cated to any loca tion within the address space (preferably in the on-chip ram area), and it is accessed by th e cpu via the stack po inter (sp) register. two separate sfrs, stkov and stkun, ar e implicitly compared against the stack pointer value upon each stack access for the detection of a st ack overflow or underflow. the high performance offered by the hardware implementation of th e cpu can efficiently be utilized by a programmer via the highly efficient xc 164sm instruction set which includes the following instruction classes: ? standard arithmetic instructions ? dsp-oriented arithmetic instructions ? logical instructions ? boolean bit manipula tion instructions ? compare and loop co ntrol instructions ? shift and rotate instructions ? prioritize instruction ? data movement instructions ? system stack instructions ? jump and call instructions ? return instructions ? system control instructions ? miscellaneous instructions the basic instruction length is either 2 or 4 bytes. possibl e operand types are bits, bytes and words. a variety of direc t, indirect or immediate addressing modes are provided to specify the required operands.
xc164sm derivatives functional description data sheet 19 v1.2, 2007-03 3.3 interrupt system with an interrupt response time of typically 8 cpu clocks (in case of internal program execution), the xc164sm is ca pable of reacting very fast to the occurrence of non- deterministic events. the architecture of the xc164sm supports several mechanisms for fast and flexible response to service requests that can be generated from various sources internal or external to the microcontrol ler. any of these interrupt requests can be programmed to being serviced by the interrupt controller or by the peripheral event controller (pec). in contrast to a standard interrupt service where the current program execution is suspended and a branch to th e interrupt vector table is performed, just one cycle is ?stolen? from the current cpu activity to perform a pec serv ice. a pec service implies a single byte or word data tran sfer between any two memory locations with an additional increment of either the pec so urce, or the destination pointer , or both. an individual pec transfer counter is implicitly decremented for each pec service except when performing in the continuous transfer m ode. when this counter reache s zero, a standard interrupt is performed to the corresponding source related vector loca tion. pec services are very well suited, for example, for supporting the transmission or reception of blocks of data. the xc164sm has 8 pec channels each of which offers such fast interrupt-driven data transfer capabilities. a separate control register wh ich contains an interrupt requ est flag, an interrupt enable flag and an interrupt priority bi t field exists for each of th e possible interrupt nodes. via its related register, each node can be progra mmed to one of sixt een interrupt priority levels. once having been accepted by the cpu, an interrupt service can only be interrupted by a higher priori tized service request. for the standard interru pt processing, each of the possible interrupt nodes has a dedicated vector location. fast external interrupt inputs are provided to service external interrupts with high precision requirements. these fast in terrupt inputs featur e programmable edge detection (rising edge, fall ing edge, or both edges). software interrupts are supported by means of the ?trap? instruction in combination with an individual trap (interrupt) number. table 4 shows all of the possibl e xc164sm interrupt source s and the corresponding hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers. note: interrupt nodes which are not assig ned to peripherals (u nassigned nodes), may be used to generate softwa re controlled interrupt requests by setting the respective interrupt request bit (xir).
xc164sm derivatives functional description data sheet 20 v1.2, 2007-03 table 4 xc164sm interrupt nodes source of interrupt or pec service request control register vector location 1) trap number ex0in cc1_cc8ic xx?0060 h 18 h / 24 d ex1in cc1_cc9ic xx?0064 h 19 h / 25 d ex2in cc1_cc10ic xx?0068 h 1a h / 26 d ex3in cc1_cc11ic xx?006c h 1b h / 27 d ex4in cc1_cc12ic xx?0070 h 1c h / 28 d ex5in cc1_cc13ic xx?0074 h 1d h / 29 d capcom register 16 cc2_cc16ic xx?00c0 h 30 h / 48 d capcom register 17 cc2_cc17ic xx?00c4 h 31 h / 49 d capcom register 18 cc2_cc18ic xx?00c8 h 32 h / 50 d capcom register 19 cc2_cc19ic xx?00cc h 33 h / 51 d capcom register 20 cc2_cc20ic xx?00d0 h 34 h / 52 d capcom register 21 cc2_cc21ic xx?00d4 h 35 h / 53 d capcom register 22 cc2_cc22ic xx?00d8 h 36 h / 54 d capcom register 23 cc2_cc23ic xx?00dc h 37 h / 55 d capcom register 24 cc2_cc24ic xx?00e0 h 38 h / 56 d capcom register 25 cc2_cc25ic xx?00e4 h 39 h / 57 d capcom register 26 cc2_cc26ic xx?00e8 h 3a h / 58 d capcom register 27 cc2_cc27ic xx?00ec h 3b h / 59 d capcom register 28 cc2_cc28ic xx?00f0 h 3c h / 60 d capcom register 29 cc2_cc29ic xx?0110 h 44 h / 68 d capcom register 30 cc2_cc30ic xx?0114 h 45 h / 69 d capcom register 31 cc2_cc31ic xx?0118 h 46 h / 70 d capcom timer 7 cc2_t7ic xx?00f4 h 3d h / 61 d capcom timer 8 cc2_t8ic xx?00f8 h 3e h / 62 d gpt1 timer 2 gpt12e_t2ic xx?0088 h 22 h / 34 d gpt1 timer 3 gpt12e_t3ic xx?008c h 23 h / 35 d gpt1 timer 4 gpt12e_t4ic xx?0090 h 24 h / 36 d gpt2 timer 5 gpt12e_t5ic xx?0094 h 25 h / 37 d gpt2 timer 6 gpt12e_t6ic xx?0098 h 26 h / 38 d
xc164sm derivatives functional description data sheet 21 v1.2, 2007-03 gpt2 caprel register gpt12e_cric xx?009c h 27 h / 39 d a/d conversion comp lete adc_cic xx?00a0 h 28 h / 40 d a/d overrun error adc_eic xx?00a4 h 29 h / 41 d asc0 transmit asc0_tic xx?00a8 h 2a h / 42 d asc0 transmit buffer asc0_tbic xx?011c h 47 h / 71 d asc0 receive asc0_ric xx?00ac h 2b h / 43 d asc0 error asc0_eic xx?00b0 h 2c h / 44 d asc0 autobaud asc0_abic xx?017c h 5f h / 95 d ssc0 transmit ssc0_tic xx?00b4 h 2d h / 45 d ssc0 receive ssc0_ric xx?00b8 h 2e h / 46 d ssc0 error ssc0_eic xx?00bc h 2f h / 47 d pll/owd pllic xx?010c h 43 h / 67 d asc1 transmit asc1_tic xx?0120 h 48 h / 72 d asc1 transmit buffer asc1_tbic xx?0178 h 5e h / 94 d asc1 receive asc1_ric xx?0124 h 49 h / 73 d asc1 error asc1_eic xx?0128 h 4a h / 74 d asc1 autobaud asc1_abic xx?0108 h 42 h / 66 d end of pec subc hannel eopic xx?0130 h 4c h / 76 d capcom6 timer t1 2 ccu6_t12ic xx?0134 h 4d h / 77 d capcom6 timer t1 3 ccu6_t13ic xx?0138 h 4e h / 78 d capcom6 emergency ccu6_eic xx?013c h 4f h / 79 d capcom6 ccu6_ic xx?0140 h 50 h / 80 d ssc1 transmit ssc1_tic xx?0144 h 51 h / 81 d ssc1 receive ssc1_ric xx?0148 h 52 h / 82 d ssc1 error ssc1_eic xx?014c h 53 h / 83 d rtc rtc_ic xx?0174 h 5d h / 93 d unassigned node ? xx?0040 h 10 h / 16 d unassigned node ? xx?0044 h 11 h / 17 d unassigned node ? xx?0048 h 12 h / 18 d unassigned node ? xx?004c h 13 h / 19 d table 4 xc164sm interrupt nodes (cont?d) source of interrupt or pec service request control register vector location 1) trap number
xc164sm derivatives functional description data sheet 22 v1.2, 2007-03 unassigned node ? xx?0050 h 14 h / 20 d unassigned node ? xx?0054 h 15 h / 21 d unassigned node ? xx?0058 h 16 h / 22 d unassigned node ? xx?005c h 17 h / 23 d unassigned node ? xx?0078 h 1e h / 30 d unassigned node ? xx?007c h 1f h / 31 d unassigned node ? xx?0080 h 20 h / 32 d unassigned node ? xx?0084 h 21 h / 33 d unassigned node ? xx?00fc h 3f h / 63 d unassigned node ? xx?0100 h 40 h / 64 d unassigned node ? xx?0104 h 41 h / 65 d unassigned node ? xx?012c h 4b h / 75 d unassigned node ? xx?0150 h 54 h / 84 d unassigned node ? xx?0154 h 55 h / 85 d unassigned node ? xx?0158 h 56 h / 86 d unassigned node ? xx?015c h 57 h / 87 d unassigned node ? xx?0160 h 58 h / 88 d unassigned node ? xx?0164 h 59 h / 89 d unassigned node ? xx?0168 h 5a h / 90 d unassigned node ? xx?016c h 5b h / 91 d unassigned node ? xx?0170 h 5c h / 92 d 1) register vecseg defines the segment where the vector table is located to. bitfield vecsc in register cpuc on1 defines the distance between two adjacent vectors. this table represents the default setting, with a dist ance of 4 (two words) between two vectors. table 4 xc164sm interrupt nodes (cont?d) source of interrupt or pec service request control register vector location 1) trap number
xc164sm derivatives functional description data sheet 23 v1.2, 2007-03 the xc164sm also provides an excellent mechanism to identify and to process exceptions or error conditions that arise during run-time , so-called ?hardware traps?. hardware traps cause immediat e non-maskable system reacti on which is similar to a standard interrupt service (b ranching to a dedicated ve ctor table location). the occurrence of a hardware trap is additionally signifi ed by an individual bit in the trap flag register (tfr). except when ano ther higher prioritized trap service is in progress, a hardware trap will interrupt any actual progra m execution. in turn, hardware trap services can normally not be interrupted by standard or pec interrupts. table 5 shows all of the possible e xceptions or error conditions that can arise during run- time: table 5 hardware trap summary exception condition trap flag trap vector vector location 1) 1) register vecseg defines the segment where the vector table is located to. bitfield vecsc in register cpuc on1 defines the distance between two adjacent vectors. this table represents the default setting, with a dist ance of 4 (two words) between two vectors. trap number trap priority reset functions: ? hardware reset ? software reset ? w-dog timer overflow ? reset reset reset xx?0000 h xx?0000 h xx?0000 h 00 h 00 h 00 h iii iii iii class a hardware traps: ? non-maskable interrupt ? stack overflow ? stack underflow ? software break nmi stkof stkuf softbrk nmitrap stotrap stutrap sbrktrap xx?0008 h xx?0010 h xx?0018 h xx?0020 h 02 h 04 h 06 h 08 h ii ii ii ii class b hardware traps: ? undefined opcode ? pmi access error ? protected instruction fault ? illegal word operand access undopc pacer prtflt illopa btrap btrap btrap btrap xx?0028 h xx?0028 h xx?0028 h xx?0028 h 0a h 0a h 0a h 0a h i i i i reserved ? ? [2c h - 3c h ][0b h - 0f h ] ? software traps ? trap instruction ?? any [xx?0000 h - xx?01fc h ] in steps of 4 h any [00 h - 7f h ] current cpu priority
xc164sm derivatives functional description data sheet 24 v1.2, 2007-03 3.4 on-chip debug support (ocds) the on-chip debug support system provides a broad range of debug and emulation features built into the xc16 4sm. the user software runn ing on the xc164sm can thus be debugged within the ta rget system environment. the ocds is controlled by an external debugging device via the debug interface, consisting of the ieee-1149-c onforming jtag port and a br eak interface. the debugger controls the ocds via a set of dedicated re gisters accessible via the jtag interface. additionally, the ocds system can be controlled by the cpu, e.g. by a monitor program. an injection interface allows the execution of ocds-generated instructions by the cpu. multiple breakpoints can be triggered by on-chip hardware, by software, or by an external trigger input. single stepping is sup ported as well as the injection of arbitrary instructions and read/write a ccess to the complete internal address space. a breakpoint trigger can be answered with a cpu-halt, a monitor call, a data transfer, or/and the activation of an external signal. tracing data can be obtained via the jtag interface. the debug interface uses a set of 6 interface sign als (4 jtag lines, 2 break lines) to communicate with external ci rcuitry. these interface sign als are realized as alternate functions on port 3 pins.
xc164sm derivatives functional description data sheet 25 v1.2, 2007-03 3.5 capture/compare unit (capcom2) the capcom unit supports generation and control of timing sequences on up to 16 channels with a maximum re solution of 1 system clock cy cle (8 cycles in staggered mode). the capcom unit is typi cally used to hand le high speed i/o tasks such as pulse and waveform generation, pulse width modu lation (pwm), digital to analog (d/a) conversion, software timing , or time recording relati ve to external events. two 16-bit timers (t7/t8) wi th reload registers provide two independen t time bases for the capture/compare register array. the input clock for the timers is programmable to several prescaled values of the internal system clock, or may be derived from an over flow/underflow of timer t6 in module gpt2. this provides a wide range of variation for th e timer period and re solution and allows precise adjustments to the application specif ic requirements. in addition, an external count input for capcom timer t7 allows event scheduling for the capture/compare registers relative to external events. the capture/compare register array cont ains 16 dual purpose capture/compare registers, each of which may be individually allocated to eith er capcom timer (t7 or t8, respectively), and programmed fo r capture or compare function. 10 registers of the capcom2 module have ea ch one port pin associated with it which serves as an input pin for triggering the capt ure function, or as an output pin to indicate the occurrence of a compare event. when a capture/compare register has been selected for capture mode, the current contents of the allo cated timer will be latc hed (?captured?) into the capture/compare table 6 compare modes (capcom2) compare modes function mode 0 interrupt- only compare mode; several compare interrupts pe r timer period are possible mode 1 pin toggles on each compare match; several compare events per timer period are possible mode 2 interrupt- only compare mode; only one compare interrupt pe r timer period is generated mode 3 pin set ?1? on ma tch; pin reset ?0? on compare timer overflow; only one compare event per timer period is generated double register mode two registers operate on one pin; pin toggles on each compare match; several compare events per timer period are possible single event mode generates single edges or pulses; can be used with any compare mode
xc164sm derivatives functional description data sheet 26 v1.2, 2007-03 register in response to an ex ternal event at the port pin which is associated with this register. in addition, a specif ic interrupt request for this capture/compare register is generated. either a po sitive, a negative, or both a positi ve and a negative external signal transition at the pin can be se lected as the triggering event. the contents of all registers which have been selected for on e of the five compare modes are continuously compared with the contents of the allocated timers. when a match occurs between the timer value and the va lue in a capture/compare register, specific actions will be taken based on th e selected compare mode.
xc164sm derivatives functional description data sheet 27 v1.2, 2007-03 figure 5 capcom2 unit block diagram sixteen 16-bit capture/ compare registers mode control (capture or compare) t7 input control t8 input control mcb05569_2 ccxirq ccxirq ccxirq capcom2 provides channels x = 16 ? 31. (see signals ccxio and ccxirq) t7irq t8irq ccxio ccxio ccxio t7in t6ouf f cc t6ouf f cc reload reg. t7rel timer t7 timer t8 reload reg. t8rel
xc164sm derivatives functional description data sheet 28 v1.2, 2007-03 3.6 the capture/compare unit capcom6 the capcom6 unit supports generation and co ntrol of timing sequences on up to three 16-bit capture/compare ch annels plus one independent 10-bit comp are channel. in compare mode the capcom6 unit provid es two output signal s per channel which have inverted polarity and no n-overlapping pulse transitions (deadtime control). the compare channel can generate a single pwm output sig nal and is further used to modulate the capture/co mpare output signals. in capture mode the contents of compare timer t12 is stored in the capture registers upon a signal tran sition at pins ccx. compare timers t12 (16-bit) and t13 (10-bit) are free running timers which are clocked by the prescaled system clock. figure 6 capcom6 block diagram for motor control applications both subunits ma y generate versatile multichannel pwm signals which are basically eith er controlled by compare ti mer t12 or by a typical hall sensor pattern at the interrupt inputs (block commutation). control cc channel 0 cc60 cc channel 1 cc61 cc channel 2 cc62 mcb04109 prescaler offset register t12of compare timer t12 16-bit period register t12p mode select register cc6msel trap register port control logic control register ctcon compare register cmp13 prescaler compare timer t13 10-bit period register t13p block commutation control cc6mcon.h cc60 cout60 cc61 cout61 cc62 cout62 ctrap cc6pos0 cc6pos1 cc6pos2 f cpu f cpu the timer registers (t12, t13) are not directly accessible. the period and offset registers are loading a value into the timer registers. cout63
xc164sm derivatives functional description data sheet 29 v1.2, 2007-03 3.7 general purpose timer (gpt12e) unit the gpt12e unit represents a very flexible multifunctional timer/c ounter structure which may be used for many different time rela ted tasks such as event timing and counting, pulse width and duty cycle me asurements, pulse generation , or pulse multiplication. the gpt12e unit incorporates five 16-bit timers which are organ ized in two separate modules, gpt1 and gpt2. each timer in each module may operate independently in a number of different modes, or may be co ncatenated with another timer of the same module. each of the three ti mers t2, t3, t4 of module gpt1 can be configured individually for one of four basic modes of operation, which are timer, gated timer, counter, and incremental interface mode. in timer mode, the in put clock for a timer is derived from the system clock, divided by a programmable prescaler, while counter mode allows a timer to be clocked in refe rence to external events. pulse width or duty cycle meas urement is supported in ga ted timer mode, where the operation of a timer is controlled by the ?gat e? level on an external input pin. for these purposes, each timer has one a ssociated port pin (txin) which serves as gate or clock input. the maximum reso lution of the timers in module gpt1 is 4 system clock cycles. the count direction (up/down ) for each timer is progra mmable by software or may additionally be altered dyna mically by an external sign al on a port pin (txeud) to facilitate e.g. position tracking. in incremental interface mode the gpt1 timers (t2, t3, t4) can be directly connected to the incremental posi tion sensor signals a and b via their respecti ve inputs txin and txeud. direction and count signals are intern ally derived from these two input signals, so the contents of the respec tive timer tx corresponds to the sensor position. the third position sensor signal top0 can be connected to an interrupt input. timer t3 has an output toggle latch (t3otl) which changes its state on each timer overflow/underflow. the state of this latch may be output on pin t3out e.g. for time out monitoring of external hardware components. it may also be used internally to clock timers t2 and t4 for m easuring long time periods with high resolution. in addition to their basic op erating modes, timers t2 and t4 may be configured as reload or capture registers for timer t3. when used as capture or reload registers, timers t2 and t4 are stopped. the c ontents of timer t3 is captured into t2 or t4 in response to a signal at their associated input pins (txin). timer t3 is re loaded with the contents of t2 or t4 triggered either by an ex ternal signal or by a selectable state transition of its toggle latch t3otl. when both t2 and t4 are config ured to alternately reload t3 on opposite state transitions of t3otl with the low and high times of a pwm signal, this signal can be constantly generated with out software intervention.
xc164sm derivatives functional description data sheet 30 v1.2, 2007-03 figure 7 block diagram of gpt1 with its maximum resolution of 2 system clock cycles, the gpt2 module provides precise event control and time measurement. it includes two ti mers (t5, t6) and a capture/reload register (caprel). both timers can be cl ocked with an input clock which is derived from the cpu clock via a programmable prescaler or with external signals. the mca05563 aux. timer t2 2 n :1 t2 mode control capture u/d basic clock f gpt t3con.bps1 t3otl t3out toggle latch t2in t2eud reload core timer t3 t3 mode control t3in t3eud u/d interrupt request (t3irq) t4 mode control u/d aux. timer t4 t4eud t4in reload capture interrupt request (t4irq) interrupt request (t2irq)
xc164sm derivatives functional description data sheet 31 v1.2, 2007-03 count direction (up/down) fo r each timer is programma ble by software or may additionally be altered dynamically by an external signal on a port pin (txeud). concatenation of the timers is supported via the output togg le latch (t6otl) of timer t6, which changes its state on ea ch timer overflow/underflow. the state of this latch may be used to clock timer t5, and/ or it may be output on pin t6out. the overflows/underflo ws of timer t6 can additi onally be used to clock the capcom2 timers, and to cause a re load from the ca prel register. the caprel register may capt ure the contents of timer t5 based on an external signal transition on the corresponding port pin (c apin), and timer t5 may optionally be cleared after the capture procedure. this allows the xc164sm to me asure absolute time differences or to perform pulse multip lication without so ftware overhead. the capture trigger (timer t5 to caprel) may also be ge nerated upon transitions of gpt1 timer t3?s inputs t3in and/or t3e ud. this is especially advantageous when t3 operates in incremental interface mode.
xc164sm derivatives functional description data sheet 32 v1.2, 2007-03 figure 8 block diagram of gpt2 mca05564 gpt2 timer t5 2 n :1 t5 mode control gpt2 caprel t3in/ t3eud caprel mode control t6 mode control reload clear u/d capture clear u/d t5in capin interrupt request (t5irq) interrupt request (t6irq) interrupt request (crirq) basic clock f gpt t6con.bps2 t6in gpt2 timer t6 t6otl t6out t6ouf toggle ff
xc164sm derivatives functional description data sheet 33 v1.2, 2007-03 3.8 real time clock the real time clock (rtc) mo dule of the xc164sm is dire ctly clocked via a separate clock driver with the prescaled on -chip main oscill ator frequency ( f rtc = f oscm /32). it is therefore independent from the selected clock generation mode of the xc164sm. the rtc basically consists of a chain of divider blocks: ? a selectable 8:1 divider (on - off) ? the reloadable 16-bit timer t14 ? the 32-bit rtc timer bloc k (accessible via registers rtch and rtcl), made of: ? a reloadable 10-bit timer ? a reloadable 6-bit timer ? a reloadable 6-bit timer ? a reloadable 10-bit timer all timers count up. each ti mer can generate an interrupt request. all requests are combined to a co mmon node request. figure 9 rtc block diagram note: the registers associated with the rtc are not affected by a reset in order to maintain the correct system time even when intermed iate resets are executed. cnt-register rel-register 10 bits 6 bits 6 bits 10 bits t14 mcb05568 t14-register interrupt sub node rtcint mux 8 pre run cnt int3 cnt int2 cnt int1 cnt int0 f cnt f rt c t14rel 10 bits 6 bits 6 bits 10 bits :
xc164sm derivatives functional description data sheet 34 v1.2, 2007-03 the rtc module can be used for different purposes: ? system clock to determine the current ti me and date, optionally during idle mode, sleep mode, and power down mode ? cyclic time based interrupt, to provid e a system time tick independent of cpu frequency and other resour ces, e.g. to wake up regularly from idle mode ? 48-bit timer for long te rm measurements (maximum timespan is > 100 years) ? alarm interrupt for wake -up on a defined time
xc164sm derivatives functional description data sheet 35 v1.2, 2007-03 3.9 a/d converter for analog signal measurement, a 10-bit a/d converter with 14 multiplexed input channels and a sample an d hold circuit has been integrated on-chip. it uses the method of successive approximation. the sample ti me (for loading the capacitors) and the conversion time is programmable (in tw o modes) and can thus be adjusted to the external circuitry. the a/d c onverter can also operate in 8-bit conversion mode, where the conversion time is further reduced. overrun error detection/prot ection is provided for the conversion result register (addat): either an interrupt request will be generated w hen the result of a previous conversion has not been read from the result register at the time the next conversion is complete, or the next conversion is suspended in such a case unti l the previous result has been read. for applications which require less analog input channels, the re maining channel inputs can be used as digita l input port pins. the a/d converter of the xc164sm supports four different conversion modes. in the standard single channel conv ersion mode, the analog leve l on a specified channel is sampled once and converted to a digital result. in the si ngle channel c ontinuous mode, the analog level on a specif ied channel is re peatedly sampled and converted without software intervention. in th e auto scan mode, the analog levels on a prespecified number of channels are sequentially sa mpled and converted. in the auto scan continuous mode, the prespeci fied channels are repeatedly sampled and converted. in addition, the conversion of a specific channel can be insert ed (injected) into a running sequence without disturbing th is sequence. this is call ed channel injection mode. the peripheral event controller (pec) ma y be used to automatically store the conversion results into a ta ble in memory for later eval uation, without requiring the overhead of entering and ex iting interrupt routines for each data transfer. after each reset and also during normal operation the adc automatically performs calibration cycles. this automatic self-calibration cons tantly adjusts the converter to changing operating conditions (e.g. temperature) and comp ensates process variations. these calibration cycles are part of the conversion cycle, so they do not affect the normal operation of the a/d converter. in order to decouple analog inputs from di gital noise and to avoid input trigger noise those pins used for analog i nput can be disconnected from th e digital input stages under software control. this can be selected for each pin sepa rately via register p5didis (port 5 digital input disable). the auto-power-down feature of the a/d c onverter minimizes the power consumption when no conversion is in progress.
xc164sm derivatives functional description data sheet 36 v1.2, 2007-03 3.10 asynchronous/synchronous serial interfaces (asc0/asc1) the asynchronous/synchronous serial inte rfaces asc0/asc1 (usarts) provide serial communication with ot her microcontrollers, processors, terminals or external peripheral components. they are upward compatible with the serial ports of the infineon 8-bit microcontroller familie s and support full-duplex asyn chronous communica tion and half- duplex synchronous co mmunication. a dedicate d baudrate generator with a fractional divider precisely generates all standard baud rates with out oscillator tuning. for transmission, reception, erro r handling, and baud rate de tection 5 separate interrupt vectors are provided. in asynchronous mode, 8- or 9- bit data frames (with optional parity bit) are transmitted or received, preceded by a start bit and terminat ed by one or two stop bits. for multiprocessor communication, a mechanism to distinguish address from data bytes has been included (8-bit data pl us wake-up bit mode). irda data transmissions up to 115.2 kbit/s with fixed or programma ble irda pulse width are supported. in synchronous mode, bytes (8 bits) are transmitted or rece ived synchronously to a shift clock which is generated by the asc0/1. the lsb is always shifted first. in both modes, transmission and reception of data is fifo-buffered. an autobaud detection unit allows to de tect asynchronous data frames with its baud rate and mode with automatic initializati on of the baudrate generator and the mode control bits. a number of optional hardware error detection cap abilities has been included to increase the reliability of data transfers. a pa rity bit can automatically be generated on transmission or be checked on reception. framing error det ection allows to recognize data frames with missing stop bits. an overrun error will be generated, if the last character received has not been read out of th e receive buffer register at the time the reception of a new ch aracter is complete. summary of features ? full-duplex asynchronous operating modes ? 8- or 9-bit data frames, lsb first, one or two stop bits, pari ty generation/checking ? baudrate from 2.5 mbit/s to 0.6 bit/s (@ 40 mhz) ? multiprocessor mode for automa tic address/data byte detection ? support for irda data trans mission/reception up to ma x. 115.2 kbit/s (@ 40 mhz) ? auto baudrate detection ? half-duplex 8-bit synchronous operating mode at 5 mbit/s to 406.9 bit/s (@ 40 mhz) ? buffered transmitter/receiver with fi fo support (8 entries per direction) ? loop-back option availa ble for testing purposes ? interrupt generation on tr ansmitter buffer empty condi tion, last bit transmitted condition, receive buffer fu ll condition, error condition (frame, par ity, overrun error), start and end of an autobaud detection
xc164sm derivatives functional description data sheet 37 v1.2, 2007-03 3.11 high speed synchronous serial channels (ssc0/ssc1) the high speed synchronous serial channels ssc0/ssc1 su pport full-duplex and half- duplex synchronous commu nication. it may be co nfigured so it inte rfaces with serially linked peripheral compo nents, full spi functi onality is supported. a dedicated baud rate generator allows to set up all standard baud rates without oscillator tuning. for transmi ssion, reception and error handling three separate interrupt vectors are provided. the ssc transmits or receives characters of 2 ? 16 bits leng th synchronously to a shift clock which can be generated by the ssc (mast er mode) or by an ex ternal master (slave mode). the ssc can star t shifting with the lsb or with the msb and allows the selection of shifting and latching clock edges as well as the clock polarity. a number of optional hardware error detection cap abilities has been included to increase the reliability of data transfers. transmit error and receive error supervise the correct handling of the data buffer. phase error and baudrate error detect incorrect serial data. summary of features ? master or slave mode operation ? full-duplex or half-duplex transfers ? baudrate generation from 20 mb it/s to 305.18 bit/s (@ 40 mhz) ? flexible data format ? programmable number of data bits: 2 to 16 bits ? programmable shift directio n: lsb-first or msb-first ? programmable clock polarity: idle low or idle high ? programmable clock/data ph ase: data shift with lead ing or trailing clock edge ? loop back option availabl e for testing purposes ? interrupt generation on transmitter bu ffer empty condition, receive buffer full condition, error condition (receive, phase, baudrate, transmit error) ? three pin interface with fl exible ssc pin configuration
xc164sm derivatives functional description data sheet 38 v1.2, 2007-03 3.12 watchdog timer the watchdog timer represen ts one of the fail-safe mechanisms which have been implemented to prevent the co ntroller from malfunctioning for longer periods of time. the watchdog timer is always enabled after a reset of th e chip, and can be disabled until the einit instruction ha s been executed (compatible mo de), or it can be disabled and enabled at any time by executing instructions diswdt and enwdt (enhanced mode). thus, the chip?s start-up procedure is always monitored. the software has to be designed to restart the watchd og timer before it overfl ows. if, due to hardware or software related failures, the software fails to do so, the watchdog timer overflows and generates an inter nal hardware reset. the watchdog timer is a 16-bit timer, cl ocked with the system clock divided by 2/4/128/256. the high by te of the watchdog ti mer register can be set to a prespecified reload value (stored in wdtrel) in order to allow further variation of the monitored time interval. each time it is serviced by the application software, the high byte of the watchdog timer is rel oaded and the low byte is cleared. thus, time intervals between 13 s and 419 ms can be m onitored (@ 40 mhz). the default watchdog timer interval after reset is 3.28 ms (@ 40 mhz).
xc164sm derivatives functional description data sheet 39 v1.2, 2007-03 3.13 clock generation the clock generation unit uses a programma ble on-chip pll with multiple prescalers to generate the clock signal s for the xc164sm with high fl exibility. the master clock f mc is the reference clock sign al and is output to the external syst em. the cpu clock f cpu and the system clock f sys are derived from the master clo ck either directly (1:1) or via a 2:1 prescaler ( f sys = f cpu = f mc / 2). see also section 4.4.1 . the on-chip oscillator can drive an external crystal or accepts an external clock signal. the oscillator clock fr equency can be multiplied by th e on-chip pll (by a programmable factor) or can be divided by a programmable prescaler factor. if the bypass mode is used (direct drive or prescaler) the pll ca n deliver an independent clock to monitor the clock sign al generated by the on-chip oscillator. this pll clock is independent from the xtal1 clock. when the expected o scillator clock transitions are missing the oscillator watchdog (owd) acti vates the pll unlock/owd interrupt node and supplies the cpu with an emergency clock, the pll clock signal. under these circumstances the pll will osci llate with its basic frequency. the oscillator watchdog can be disabled by switching the pll o ff. this reduces power consumption, but also no in terrupt request will be gene rated in case of a missing oscillator clock.
xc164sm derivatives functional description data sheet 40 v1.2, 2007-03 3.14 parallel ports the xc164sm provides up to 47 i/o lines which are organized in to three input/output ports and one input port. all po rt lines are bit-addressable, and all input/out put lines are individually (bit-wise) progra mmable as inputs or outputs via direction registers. the i/o ports are true bidirectional ports which are switched to high impedance state when configured as inpu ts. the output drivers of some i/o ports can be configured (pin by pin) for push/pull operation or open -drain operation via control registers. during the internal reset, all port pins are configured as inputs. the edge characteristics (sh ape) and driver characteristi cs (output current) of the port drivers can be selected via registers poconx. the input threshold of some ports is select able (ttl or cmos like), where the special cmos like input threshold reduces noise se nsitivity due to the input hysteresis. the input threshold may be selected individually for each byte of the respective ports. all port lines have programmable alternate input or output func tions associated with them. all port lines that are not used for thes e alternate functions may be used as general purpose io lines. table 7 summary of the xc 164sm?s parallel ports port control alternate functions port1 pad drivers capture input s or compare outputs, serial interface lines port 3 pad drivers, open drain, input threshold timer control signals, serial interface lines, system clock output clkout (or fout) port 5 ? analog input channels to the a/d converter, timer control signals port 9 pad drivers, open drain, input threshold capture inputs or compare outputs
xc164sm derivatives functional description data sheet 41 v1.2, 2007-03 3.15 power management the xc164sm provides several means to control th e power it consumes either at a given time or averaged over a certain time span. three mechanisms can be used (partly in parallel): ? power saving modes switch the xc164sm into a sp ecial operating mode (control via instructions). idle mode stops the cpu while the peripherals ca n continue to operate. sleep mode and power down mo de stop all clock signals a nd all operation (rtc may optionally continue running) . sleep mode can be termina ted by external interrupt signals. ? clock generation management controls the distribu tion and the frequency of internal and external clock signals. while th e clock signals for currently inactive parts of logic are disabled automa tically, the user can redu ce the xc164sm?s cpu clock frequency which drastically reduces the consumed power. external circuitry can be controlled via the programmable frequency output fout. ? peripheral management permits temporary disabling of peripheral modules (control via register syscon3). ea ch peripheral can separat ely be disabled/enabled. the on-chip rtc supports intermittent opera tion of the xc164sm by generating cyclic wake-up signals. this offers full performance to quickly re act on action requests while the intermittent sleep phases greatly reduce the average power consumption of the system.
xc164sm derivatives functional description data sheet 42 v1.2, 2007-03 3.16 instruction set summary table 8 lists the instructions of th e xc164sm in a condensed way. the various addressing modes that can be used with a specific instruction, the operation of the instructions, parameters for conditional exec ution of instructio ns, and the opcodes for each instruction can be found in the ?instruction set manual? . this document also provides a deta iled description of each instruction. table 8 instruction set summary mnemonic description bytes add(b) add word (byt e) operands 2 / 4 addc(b) add word (byte) operands with carry 2 / 4 sub(b) subtract word (byte) operands 2 / 4 subc(b) subtract word (byte) operands with carry 2 / 4 mul(u) (un)signed multiply di rect gpr by direct gpr (16- 16-bit) 2 div(u) (un)signed divide register mdl by direct gpr (16-/16-bit) 2 divl(u) (un)signed long divide reg. md by dire ct gpr (32-/16-bit) 2 cpl(b) complement direct word (byte) gpr 2 neg(b) negate direct word (byte) gpr 2 and(b) bitwise an d, (word/byte operands) 2 / 4 or(b) bitwise or, (word/byte operands) 2 / 4 xor(b) bitwise exclusive or, (word/byte operands) 2 / 4 bclr/bset clear/set direct bit 2 bmov(n) move (negated) dire ct bit to direct bit 4 band/bor/bxor and/or/xor dire ct bit with direct bit 4 bcmp compare direct bit to direct bit 4 bfldh/bfldl bitwise modify masked high/low byte of bit-addressable direct word memory with immediate data 4 cmp(b) compare word (byte) operands 2 / 4 cmpd1/2 compare word data to gpr and decrement gpr by 1/2 2 / 4 cmpi1/2 compare word data to gpr and increment gpr by 1/2 2 / 4 prior determine number of shif t cycles to normalize direct word gpr and store result in direct word gpr 2 shl/shr shift left/right direct word gpr 2
xc164sm derivatives functional description data sheet 43 v1.2, 2007-03 rol/ror rotate left/rig ht direct word gpr 2 ashr arithmetic (sign bit) sh ift right direct word gpr 2 mov(b) move word (byte) data 2 / 4 movbs/z move byte operand to word op. with si gn/zero extension 2 / 4 jmpa/i/r jump absolute/indirect/r elative if condition is met 4 jmps jump absolute to a code segment 4 jb(c) jump relative if direct bit is set (and clear bit) 4 jnb(s) jump relative if direct bit is not set (and set bit) 4 calla/i/r call absolute/indirect/relat ive subroutine if condition is met 4 calls call absolute subroutin e in any code segment 4 pcall push direct word regist er onto system stack and call absolute subroutine 4 trap call interrupt service rout ine via immediate trap number 2 push/pop push/pop direct word register onto/from system stack 2 scxt push direct word register onto system stack and update register with word operand 4 ret(p) return from intra-segment subroutine (and pop direct word register from system stack) 2 rets return from inter-segment subroutine 2 reti return from interr upt service subroutine 2 sbrk software break 2 srst software reset 4 idle enter idle mode 4 pwrdn enter power down mode (supposes nmi -pin being low) 4 srvwdt service watchdog timer 4 diswdt/enwdt disable/e nable watchdog timer 4 einit end-of-initializa tion register lock 4 atomic begin atomic sequence 2 extr begin extended register sequence 2 extp(r) begin extended page (and register) sequence 2 / 4 exts(r) begin extended segment ( and register) sequence 2 / 4 table 8 instruction set summary (cont?d) mnemonic description bytes
xc164sm derivatives functional description data sheet 44 v1.2, 2007-03 nop null operation 2 comul/comac multiply (and accumulate) 4 coadd/cosub add/subtract 4 co(a)shr (arithmetic) shift right 4 coshl shift left 4 coload/store load accumula tor/store mac register 4 cocmp compare 4 comax/min maximum/minimum 4 coabs/cornd absolute val ue/round accumulator 4 comov data move 4 coneg/nop negate accumulator/null operation 4 table 8 instruction set summary (cont?d) mnemonic description bytes
xc164sm derivatives electrical parameters data sheet 45 v1.2, 2007-03 4 electrical parameters the operating range for the xc164sm is define d by its electrical parameters. for proper operation the indicated limi tations must be respecte d when designing a system. 4.1 general parameters these parameters are valid for all subsequ ent descriptions, un less otherwise noted. note: stresses above those listed under ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions abov e those indicated in the operational sections of this specification is not im plied. exposure to absolute maximum rating conditions for extended periods ma y affect device reliability. during absolute maximum ra ting overload conditions ( v in > v ddp or v in < v ss ) the voltage on v ddp pins with respect to ground ( v ss ) must not exceed the values defined by the absol ute maximum ratings. table 9 absolute maximum ratings parameter symbol limit values unit notes min. max. storage temperature t st -65 150 c 1) 1) moisture sensitivity level (msl) 3, conforming to jedec j-std-020c for 260 c. junction temperature t j -40 150 c under bias voltage on v ddi pins with respect to ground ( v ss ) v ddi -0.5 3.25 v ? voltage on v ddp pins with respect to ground ( v ss ) v ddp -0.5 6.2 v ? voltage on any pin with respect to ground ( v ss ) v in -0.5 v ddp + 0.5 v 2) 2) input pin xtal1 belongs to the core voltage domain. therefore, input voltages mu st be within the range defined for vddi. input current on any pin during overload condition ?-1010ma? absolute sum of all input currents during overload condition ? ? |100| ma ?
xc164sm derivatives electrical parameters data sheet 46 v1.2, 2007-03 operating conditions the following operating condit ions must not be exceeded to ensure correct operation of the xc164sm. all parameters specified in the following sections refer to these operating conditions, unless otherwise noticed. table 10 operating condition parameters parameter symbol limit values unit notes min. max. digital supply voltage for the core v ddi 2.35 2.7 v active mode, f cpu = f cpumax 1) 1) f cpumax = 40 mhz for devices marked ? 40f, f cpumax = 20 mhz for devices marked ? 20f. digital supply voltage for io pads v ddp 4.4 5.5 v active mode 2)3) 2) external circuitry must gu arantee low-level at the rstin pin at least until both power supply voltages have reached the operating range. 3) the specified voltage range is allowed for operation. the range limits may be reached under extreme operating conditions. however, specified parameters , such as leakage currents, refer to the standard operating voltage range of v ddp = 4.75 v to 5.25 v. supply voltage difference v dd -0.5 ? v v ddp - v ddi 4) 4) this limitation must be fulfilled under all operating conditions including power-ramp-up, power-ramp-down, and power-save modes. digital ground voltage v ss 0 v reference voltage overload current i ov -5 5 ma per io pin 5)6) -2 5 ma per analog input pin 5)6) overload current coupling factor for analog inputs 7) k ova ?1.0 10 -4 ? i ov > 0 ?1.5 10 -3 ? i ov < 0 overload current coupling factor for digital i/o pins 7) k ovd ?5.0 10 -3 ? i ov > 0 ?1.0 10 -2 ? i ov < 0 absolute sum of overload currents | i ov |? 50 ma 6) external load capacitance c l ? 50 pf pin drivers in default mode 8) ambient temperature t a 070 c sab-xc164? -40 85 c saf-xc164? -40 125 c sak-xc164?
xc164sm derivatives electrical parameters data sheet 47 v1.2, 2007-03 parameter interpretation the parameters listed in th e following partly represent the characteristics of the xc164sm and partly its demands on the system. to aid in interpreting the parameters right, when evaluating them for a design , they are marked in column ?symbol?: cc ( c ontroller c haracteristics): the logic of the xc164sm will provide signa ls with the respective characteristics. sr ( s ystem r equirement): the external system must prov ide signals with the respecti ve characteristics to the xc164sm. 5) overload conditions occur if the standard operating condit ions are exceeded, i.e. the voltage on any pin exceeds the specified range: v ov > v ddp + 0.5 v ( i ov > 0) or v ov < v ss - 0.5 v ( i ov < 0). the absolute sum of input overload currents on all pins may not exceed 50 ma . the supply voltages must remain within the specified limits. proper operation is not guaranteed if overload co nditions occur on functional pins such as xtal1. 6) not subject to production test - verified by design/characterization. 7) an overload current ( i ov ) through a pin injects a certain error current ( i inj ) into the adjacent pins. this error current adds to the respective pin?s leakage current ( i oz ). the amount of error current depends on the overload current and is defined by the overload coupling factor k ov . the polarity of the injected error current is inverse compared to the polarity of the overload current that produces it. the total current through a pin is | i tot | = | i oz | + (| i ov | k ov ). the additional error cu rrent may distort the input voltage on analog inputs. 8) the timing is valid for pin drivers operating in defaul t current mode (selected after reset). reducing the output current may lead to increased delays or reduced driving capability ( c l ).
xc164sm derivatives electrical parameters data sheet 48 v1.2, 2007-03 4.2 dc parameters these parameters are static or average values, which may be exceeded during switching transitions (e.g. output current). table 11 dc characteristics (operating conditions apply) 1) parameter symbol limit va lues unit test condition min. max. input low voltage ttl (all except xtal1) v il sr -0.5 0.2 v ddp - 0.1 v? input low voltage xtal1 2) v ilc sr -0.5 0.3 v ddi v? input low voltage (special threshold) v ils sr -0.5 0.45 v ddp v 3) input high voltage ttl (all except xtal1) v ih sr 0.2 v ddp + 0.9 v ddp + 0.5 v ? input high voltage xtal1 2) v ihc sr 0.7 v ddi v ddi + 0.5 v ? input high voltage (special threshold) v ihs sr 0.8 v ddp - 0.2 v ddp + 0.5 v 3) input hysteresis (special threshold) hys 0.04 v ddp ?v v ddp in [v], series resis- tance = 0 3) output low voltage v ol cc ? 1.0 v i ol i olmax 4) ?0.45v i ol i olnom 4)5) output high voltage 6) v oh cc v ddp - 1.0 ? v i oh i ohmax 4) v ddp - 0.45 ?v i oh i ohnom 4)5) input leakage current (port 5) 7) i oz1 cc ? 300 na 0 v < v in < v ddp , t a 125 c 200 na 0 v < v in < v ddp , t a 85 c 12) input leakage current (all other 8) ) 7) i oz2 cc ? 500 na 0.45 v < v in < v ddp configuration pull-up current 9) i cpuh 10) ?-10 a v in = v ihmin i cpul 11) -100 ? a v in = v ilmax
xc164sm derivatives electrical parameters data sheet 49 v1.2, 2007-03 xtal1 input current i il cc ? 20 a0 v < v in < v ddi pin capacitance 12) (digital i nputs/outputs) c io cc ? 10 pf ? 1) keeping signal levels within the limi ts specified in this table, ensures operation without overload conditions. for signal levels outside these specifications, also refer to the specification of the overload current i ov . 2) if xtal1 is driven by a crystal, reaching an amplitude (peak to peak) of 0.4 v ddi is sufficient. 3) this parameter is tested for p3, p9. 4) the maximum deliverable output curr ent of a port driver depends on th e selected output driver mode, see table 12 , current limits for port output drivers . the limit for pin groups must be respected. 5) as a rule, with decreasing output current the out put levels approach the respective supply level ( v ol v ss , v oh v ddp ). however, only the levels for nom inal output curr ents are guaranteed. 6) this specification is not valid for outputs which are sw itched to open drain mode. in this case the respective output will float and the voltage re sults from the external circuitry. 7) an additional error current ( i inj ) will flow if an overload current flows through an adjacent pi n. please refer to the definition of the overload coupling factor k ov . 8) the driver of p3.15 is designed for faster switching, because this pin can deliver the system clock (clkout). the maximum leakage current for p3 .15 is, therefore, increased to 1 a. 9) during a hardware reset this specif ication is valid for configuration on p1h.4, p1h.5, p9.4 and p9.5. after a hardware reset this specification is valid for nmi . 10) the maximum current may be drawn while the respective signal line remains inactive. 11) the minimum current must be drawn to drive the respective signal line active. 12) not subject to production test - verified by design/characterization. table 12 current limits fo r port output drivers port output driver mode maximum output current ( i olmax , - i ohmax ) 1) 1) an output current above | i oxnom | may be drawn from up to three pins at the same time. for any group of 16 neighboring port output pi ns the total output current in each direction ( i ol and - i oh ) must remain below 50 ma. nominal output current ( i olnom , - i ohnom ) strong driver 10 ma 2.5 ma medium driver 4.0 ma 1.0 ma weak driver 0.5 ma 0.1 ma table 11 dc characteristics (operating conditions apply) 1) (cont?d) parameter symbol limit va lues unit test condition min. max.
xc164sm derivatives electrical parameters data sheet 50 v1.2, 2007-03 table 13 power consumption xc164sm (operating conditions apply) parameter sym- bol limit values unit test condition min. max. power supply current (active) with all peripherals active i ddi ?15 + 2.6 f cpu ma f cpu in [mhz] 1)2) , -16f derivatives 1) during flash programming or er ase operations the supply curr ent is increased by max. 5 ma. 2) the supply current is a function of the operat ing frequency. this dependency is illustrated in figure 10 . these parameters are tested at v ddimax and maximum cpu clock frequency with all outputs disconnected and all inputs at v il or v ih . ? 10 + 2.6 f cpu ma f cpu in [mhz] 1)2) , -4f/8f derivatives pad supply current i ddp ?5 ma 3) 3) the pad supply voltage pins ( v ddp ) mainly provides the current consumed by the pin output drivers. a small amount of current is consumed even though no output s are driven, because the drivers? input stages are switched and also the flash module draws some power from the v ddp supply. idle mode supply current with all peripherals active i idx ?15 + 1.2 f cpu ma f cpu in [mhz] 2) , -16f derivatives ? 10 + 1.2 f cpu ma f cpu in [mhz] 2) , -4f/8f derivatives sleep and po wer down mode supply current caused by leakage 4) 4) the total supply current in sleep and power down mode is the sum of the temperature dependent leakage current and the frequency dependent current for rtc and main oscillator. i pdl 5) 5) this parameter is determined mainly by the transistor leakage currents. this current heavily depends on the junction temperature (see figure 12 ). the junction temperature t j is the same as the ambient temperature t a if no current flows through the port output drivers. otherwise, the result ing temperature difference must be taken into account. ?84,000 e - ma v ddi = v ddimax 6) t j in [ c] = 4380 / (273 + t j ) -16f derivatives 6) all inputs (including pins configured as inputs) at 0 v to 0.1 v or at v ddp - 0.1 v to v ddp , all outputs (including pins configured as outputs) disconnecte d. this parameter is tested at 25 c and is valid for t j 25 c. ? 128,000 e - ma = 4670 / (273 + t j ) -4f/8f derivatives sleep and po wer down mode supply current caused by leakage and the rtc running, clocked by the main oscillator 4) i pdm 7) 7) this parameter is determi ned mainly by the current c onsumed by the oscillator swit ched to low gain mode (see figure 11 ). this current, however, is influenced by the external oscillato r circuitry (crystal, capacitors). the given values refer to a typical circuitry and may change in case of a not optimized external oscillator circuitry. ? 0.6 + 0.02 f osc + i pdl ma v ddi = v ddimax f osc in [mhz]
xc164sm derivatives electrical parameters data sheet 51 v1.2, 2007-03 figure 10 supply/idle current as a function of operating frequency i [ma] f cpu [mhz] 10 20 30 40 i ddimax i ddityp i idxmax i idxtyp 20 40 60 80 100 120 140 -4f/8f -16f -16f -4f/8f -16f -4f/8f -16f -4f/8f
xc164sm derivatives electrical parameters data sheet 52 v1.2, 2007-03 figure 11 sleep and power down supply current due to rtc and oscillator running, as a function of oscillator frequency figure 12 sleep and power down leak age supply current as a function of temperature i [ma] f osc [mhz] 4 8 12 16 i pdmmax i pdmtyp 1.0 2.0 3.0 [ma] t j [ c] 0 50 100 150 i pdl 0.5 1.0 1.5 -50 -16f -4f/8f
xc164sm derivatives electrical parameters data sheet 53 v1.2, 2007-03 4.3 analog/digital converter parameters these parameters describe how the opti mum adc performance can be reached. table 14 a/d converter characteristics (operating conditions apply) parameter symbol limit values unit test condition min. max. analog reference supply v aref sr 4.5 v ddp + 0.1 v 1) 1) tue is tested at v aref = v ddp + 0.1 v, v agnd = 0 v. it is verified by design for all other voltages within the defined voltage range. if the analog reference supply vo ltage drops below 4.5 v (i.e. v aref 4.0 v) or exceeds the power supply voltage by up to 0.2 v (i.e. v aref = v ddp + 0.2 v) the maximum tue is increased to 3 lsb. this range is not subject to production test. the specified tue is guaranteed only, if the absolute sum of input overload currents on port 5 pins (see i ov specification) does not exceed 10 ma, and if v aref and v agnd remain stable during the respective period of time. during the reset calibration sequence the maximum tue may be 4 lsb. analog reference ground v agnd sr v ss - 0.1 v ss + 0.1 v ? analog input voltage range v ain sr v agnd v aref v 2) basic clock frequency f bc 0.5 20 mhz 3) conversion time for 10-bit result 4) t c10p cc 52 t bc + t s + 6 t sys ? post-calibr. on t c10 cc 40 t bc + t s + 6 t sys ? post-calibr. off conversion time for 8-bit result 4) t c8p cc 44 t bc + t s + 6 t sys ? post-calibr. on t c8 cc 32 t bc + t s + 6 t sys ? post-calibr. off calibration time after reset t cal cc 484 11,696 t bc 5) total unadjusted error tue cc ? 2lsb 1) total capacitance of an analog input c aint cc ? 15 pf 6) switched capacitance of an analog input c ains cc ? 10 pf 6) resistance of the analog input path r ain cc ? 2 k 6) total capacitance of the reference input c areft cc ? 20 pf 6) switched capacitance of the reference input c arefs cc ? 15 pf 6) resistance of the reference input path r aref cc ? 1 k 6)
xc164sm derivatives electrical parameters data sheet 54 v1.2, 2007-03 figure 13 equivalent circ uitry for analog inputs 2) v ain may exceed v agnd or v aref up to the absolute maximum ratings. however, the conversion result in these cases will be x000 h or x3ff h , respectively. 3) the limit values for f bc must not be exceeded when selecting the peripheral frequency and the adctc setting. 4) this parameter includes the sample time t s , the time for determining the digital result and the time to load the result register with the conversion result ( t sys = 1/ f sys ). values for the basic clock t bc depend on programming and can be taken from table 15 . when the post-calibration is switched off, the conversion time is reduced by 12 t bc . 5) the actual duration of the reset calibration depen ds on the noise on the reference signal. conversions executed during the reset calibration increase the calibration time. the tue for those conversions may be increased. 6) not subject to production test - verified by design/characterization. the given parameter values cover the complete o perating range. under relaxed operating conditions (temperature, supply voltage) reduced values can be us ed for calculations. at room temperature and nominal supply voltage the following typical values can be used: c ainttyp = 12 pf, c ainstyp = 7 pf, r aintyp = 1.5 k , c arefttyp = 15 pf, c arefstyp = 13 pf, r areftyp = 0.7 k . a/d converter mcs05570 r source v ain c ext c aint c ains - r ain, on c ains
xc164sm derivatives electrical parameters data sheet 55 v1.2, 2007-03 sample time and conversion time of th e xc164sm?s a/d conver ter are programmable. in compatibility mode, the above timing can be ca lculated using table 15 . the limit values for f bc must not be exceeded when selecting adctc. converter timing example: table 15 a/d converter computation table 1) 1) these selections are available in compatibility mode. an improved mechanism to control the adc input clock can be selected. adcon.15|14 (adctc) a/d converter basic clock f bc adcon.13|12 (adstc) sample time t s 00 f sys / 4 00 t bc 8 01 f sys / 2 01 t bc 16 10 f sys / 16 10 t bc 32 11 f sys / 8 11 t bc 64 assumptions: f sys = 40 mhz (i.e. t sys = 25 ns), adctc = ?01?, adstc = ?00? basic clock f bc = f sys / 2 = 20 mhz, i.e. t bc = 50 ns sample time t s = t bc 8 = 400 ns conversion 10-bit: with post-calibr. t c10p = 52 t bc + t s + 6 t sys = (2600 + 400 + 150) ns = 3.15 s post-calibr. off t c10 = 40 t bc + t s + 6 t sys = (2000 + 400 + 150) ns = 2.55 s conversion 8-bit: with post-calibr. t c8p = 44 t bc + t s + 6 t sys = (2200 + 400 + 150) ns = 2.75 s post-calibr. off t c8 = 32 t bc + t s + 6 t sys = (1600 + 400 + 150) ns = 2.15 s
xc164sm derivatives electrical parameters data sheet 56 v1.2, 2007-03 4.4 ac parameters these parameters describe the dy namic behavior of the xc164sm. 4.4.1 definition of internal timing the internal operation of th e xc164sm is controlled by the internal master clock f mc . the master clock signal f mc can be generated from t he oscillator clock signal f osc via different mechanisms. the duration of master clock periods (tcms) and their variation (and also the derived external timing) depend on th e used mechanism to generate f mc . this influence must be r egarded when calculating t he timings for the xc164sm. figure 14 generation mechanis ms for the master clock note: the example for pll operation shown in figure 14 refers to a pll factor of 1:4, the example for prescaler operation refers to a divider factor of 2:1. mct05555 phase locked loop operation (1:n) f osc direct clock drive (1:1) prescaler operation (n:1) f mc f osc f mc f osc f mc tcm tcm tcm
xc164sm derivatives electrical parameters data sheet 57 v1.2, 2007-03 the used mechanism to generat e the master clock is sele cted by register pllcon. cpu and ebc are clocked wi th the cpu clock signal f cpu . the cpu clock can have the same frequency as the master clock ( f cpu = f mc ) or can be the master clock divided by two: f cpu = f mc / 2. this factor is selected by bit cpsy s in register syscon1. the specification of the extern al timing (ac charac teristics) depends on the period of the cpu clock, called ?tcp?. the other peripherals are supplied with th e system clock signal f sys which has the same frequency as the cpu clock signal f cpu . bypass operation when bypass operation is co nfigured (pllctrl = 0x b ) the master cloc k is derived from the internal oscillator (in put clock signal xtal1) thro ugh the input- and output- prescalers: f mc = f osc / ((pllidiv + 1) (pllodiv + 1)). if both divider factors are selected as ?1? (pllidiv = pllodiv = ?0?) the frequency of f mc directly follows the frequency of f osc so the high and low time of f mc is defined by the duty cycle of the input clock f osc . the lowest master clock frequency is achiev ed by selecting the ma ximum values for both divider factors: f mc = f osc / ((3 + 1) (14 + 1)) = f osc / 60. phase locked loop (pll) when pll operation is c onfigured (pllctrl = 11 b ) the on-chip phase locked loop is enabled and provides the mast er clock. the pll multiplies the input frequency by the factor f ( f mc = f osc f ) which results from the input divi der, the multiplication factor, and the output divider ( f = pllmul+1 / (pllidiv+1 pllodiv+1)). the pll circuit synchronizes the master clock to the input clock. this sync hronization is done smoothly, i.e. the master clock frequenc y does not change abruptly. due to this adaptation to t he input clock th e frequency of f mc is constantly adjusted so it is locked to f osc . the slight variati on causes a jitter of f mc which also affects the duration of individual tcms. the timing listed in t he ac characteristics re fers to tcps. because f cpu is derived from f mc , the timing must be calculated using th e minimum tcp possible under the respective circumstances. the actual minimum value for tcp depends on the jitter of the pll. as the pll is constantly adjusting its output frequency so it corresponds to the applied input frequency (crystal or oscillator) the rela tive deviation for periods of mo re than one tcp is lower than for one single tcp (see formula and figure 15 ).
xc164sm derivatives electrical parameters data sheet 58 v1.2, 2007-03 this is especially important fo r bus cycles using waitstates and e.g. for the operation of timers, serial interfac es, etc. for all slower operations and longer periods (e.g. pulse train generation or measurement, lower baudrates, etc.) the deviation caused by the pll jitter is negligible. the value of the accumulat ed pll jitter depends on the number of consecutive vco output cycles within the respec tive timeframe. the vco outp ut clock is divided by the output prescaler (k = pl lodiv+1) to generate th e master clock signal f mc . therefore, the number of vco cycles can be represented as k n , where n is the number of consecutive f mc cycles (tcm). for a period of n tcm the accumulated pll jitter is defined by the deviation d n : d n [ns] = (1.5 + 6.32 n / f mc ); f mc in [mhz], n = number of consecutive tcms. so, for a period of 3 tcms @ 20 mhz and k = 12: d 3 = (1.5 + 6.32 3 / 20) = 2.448 ns. this formula is applicable for k n < 95. for longer periods the k n = 95 value can be used. this steady value c an be approximated by: d nmax [ns] = (1.5 + 600 / (k f mc )). figure 15 approximated accumulated pll jitter note: the bold lines indicate the minimum accumulated jitter which can be achieved by selecting the maximum possible output prescaler factor k. mcd05566 n 0 1 2 3 4 5 6 7 8 acc. jitter d n 0510 15 20 25 ns k = 15 k = 12 k = 10 k = 8 k = 6 k = 5 1 10 mhz 20 mhz 40 mhz
xc164sm derivatives electrical parameters data sheet 59 v1.2, 2007-03 different frequency band s can be selected for the vco, so the operati on of the pll can be adjusted to a wide range of input and output frequencies: table 16 vco bands for pll operation 1) 1) not subject to production test - verified by design/characterization. pllcon.pllvb vco frequency range base frequency range 00 100 ? 150 mhz 20 ? 80 mhz 01 150 ? 200 mhz 40 ? 130 mhz 10 200 ? 250 mhz 60 ? 180 mhz 11 reserved
xc164sm derivatives electrical parameters data sheet 60 v1.2, 2007-03 4.4.2 on-chip flash operation the xc164sm?s flash module delivers dat a within a fixed access time (see table 17 ). accesses to the flash module are controlled by the pmi and take 1+ws clock cycles, where ws is the number of flash access waitstates sele cted via bitfield wsflash in register imbctrl. th e resulting duration of the ac cess phase must cover the access time t acc of the flash array. the required flas h waitstates depend on the actual system frequency. the flash access waitstates only affect non-sequential accesses . due to prefetching mechanisms, the performance for sequenti al accesses (dependin g on the software structure) is only partiall y influenced by waitstates. in typical applications, eliminating one wa itstate increases the average performance by 5% ? 15%. example: for an operating frequency of 40 mhz (clock cycle = 25 ns), the flash accesses must be executed with 1 waitstate: ((1+1) 25 ns) 50 ns. table 18 indicates the interrelation of waitstates and system frequency. note: the maximum achievable system frequency is limited by the properties of the respective derivative, i. e. 40 mhz (or 20 mhz for xc164sm-xf20f devices). table 17 flash characteristics (operating conditions apply) parameter symbol limit values unit min. typ. max. flash module access time t acc cc??50 1) 1) the actual access time is influenced by the system frequency, see table 18 . ns programming time per 128-byte block t pr cc ? 2 2) 2) programming and erase time depends on the syste m frequency. typical values are valid for 40 mhz. 5ms erase time per sector t er cc ? 200 2) 500 ms table 18 flash access waitstates required waitstates frequency range 0 ws (wsflash = 00 b ) f cpu 20 mhz 1 ws (wsflash = 01 b ) f cpu 40 mhz
xc164sm derivatives electrical parameters data sheet 61 v1.2, 2007-03 4.4.3 external clock drive xtal1 these parameters define the extern al clock supply for the xc164sm. figure 16 external clock drive xtal1 note: if the on-chip oscillator is used together wi th a crystal or a ce ramic resonator, the oscillator frequency is limited to a range of 4 mhz to 16 mhz. it is strongly recommended to measur e the oscillation al lowance (negative resistance) in the final target system (layout) to de termine the optimum parameters for the oscillator operation. pl ease refer to the lim its specified by the crystal supplier. when driven by an external clock signa l it will accept the specified frequency range. operation at lower input frequencies is possible but is verified by design only (not subject to production test). table 19 external clock drive characteristics (operating conditions apply) parameter symbol limit values unit min. max. oscillator period t osc sr 25 250 1) 1) the maximum limit is only relevant for pll operation to ensure the minimum input frequency for the pll. ns high time 2) 2) the clock input signal must reach the defined levels v ilc and v ihc . t 1 sr6?ns low time 2) t 2 sr6?ns rise time 2) t 3 sr?8ns fall time 2) t 4 sr?8ns mct05572 t 1 t 2 t osc t 3 t 4 0.5 v ddi v ilc v ihc
xc164sm derivatives package and reliability data sheet 62 v1.2, 2007-03 5 package and reliability in addition to the electrical parameters , the following informa tion ensures proper integration of the xc164s m into the target system. 5.1 packaging these parameters describe the ho using rather t han the silicon. package outlines figure 17 pg-lqfp-64-4 (plastic green low profile quad flat package) , valid for the - 16f derivatives
xc164sm derivatives package and reliability data sheet 63 v1.2, 2007-03 figure 18 pg-tqfp-64-8 (plastic thin quad flat package), valid for the -4f/8f derivatives you can find all of our packages, sorts of packing and others in our infineon internet page ?products?: http://www.infineon.com/products dimensions in mm. table 20 package parameters parameter symbol limit values unit notes min. max. pg-lqfp-64-4 thermal resistance junction to case r jc ?8k/w? thermal resistance junction to leads r jl ?23k/w? pg-tqfp-64-8 thermal resistance junction to case r jc ?9k/w? thermal resistance junction to leads r jl ?19k/w? 1) does not include plastic or metal protrusion of 0.25 max. per side 4x 64 1 index marking 0.08 d a 10 1) 12 -0.03 +0.07 0.2 0.5 7.5 a-b d 64x c 0.2 0.2 b a-b a-b d d h 0.1 c m ?.05 1.4 1.6 max. 0.08 ?.05 ?.15 4x h 0.6 7? max. 0.15 +0.03 -0.06 12 10 1) 2) 2) does not include dambar protrusion of 0.08 max. per side
xc164sm derivatives package and reliability data sheet 64 v1.2, 2007-03 5.2 flash memory parameters the data retention time of the xc164sm?s fl ash memory (i.e. the time after which stored data can still be retrieved) depends on the number of ti mes the flash memory has been erased and programmed. table 21 flash parameters parameter symbol limit values unit notes min. max. data retention time t ret 15 ? years 10 3 erase/program cycles flash erase endurance n er 20 10 3 ? cycles data retention time 5years
www.infineon.com published by infineo n technologies ag b158-h8890-g1-x-7600

▲Up To Search▲

Price & Availability of SAF-XC164SM-16F20F

	To Download SAF-XC164SM-16F20F Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .